Meng-Hsin Chen 陳孟歆

Integration / Develpoment / Solution Provider 整合 / 開發 / 技術支援工程師

Task-oriented engineer based in Taiwan. Former TSMC Process Integration Engineer with 8 years experience.
Pursued self-study in programming and IT, starting a new path of Customer Slution Provider at Microsoft.
Adapt to unfamiliar fields, embracing a growth mindset, with passion for continuous self-improvement. 畢業於台大材料所，住在瑞典一年，跑過一場馬拉松。
曾是台積電整合工程師，希望跨出舒適圈，於是基於熱情自學程式，成為微軟亞太區技術支援工程師。
從硬體跨足軟體，樂於實踐技術，更熱愛與人合作，前端與後端均有涉略。

Contact Me >> 聯絡我 >> My Resume >> 履歷表 >>

Expertise 專業 / Experience 經歷 / Education 學歷

Expertise 專業

What I've learned and what I've been learning.

Programming 程式語言
  • C#
  • Python
  • JavaScript (jQuery, React.js)
  • SQL (MS SQL Server, Oracle)
  • HTML
  • CSS
  • Excel VBA
SaaS 軟體即服務
  • Microsoft Dynamics
  • Power Platform
  • Power Apps
  • Power Automate
  • Power Virtual Agents
Information Technology 資訊科學
  • Azure
  • RDBMS
  • Windows Forms
  • ASP.NET
  • UI Design

Semiconductor Industrial 半導體工程
  • Advanced Packaging
  • Defect Analysis
  • Yield Improvement
  • Technology Management
Technical 專業技術
  • Microsoft Certified AZ-900: Azure Fundatmentals
  • Microsoft Certified PL-900: Power Platform Fundatmentals

Microsoft Certified: Azure Fundamentals Microsoft Certified: Power Platform Fundamentals

Language 語言
  • TOEFL iBT: 112
  • Reading: 28
  • Listening: 29
  • Speaking: 28 (GFG)
  • Writing: 27 (GG)

Experience 經歷

Grow to become bigger than my problems.

Microsoft 微軟

  • Jul 2022 - Present Jul 2022 - 在職中

    Technical Support Engineer 技術支援工程師

    • Integrated customers need to implement and optimize Microsoft cloud products, including Azure cloud services, Dynamics CRM, and Power Platform low-code applications. 整合客戶需求，實施並安排微軟雲端產品改進計劃，包括 Azure 雲端服務、Dynamics CRM 企業流程整合服務、Power Platform 低代碼應用服務。
    • Provided technical guidance and system training to enterprise users in APAC region, assisting over 300 organizations in building project solutions and resolving technical issues with highly-skilled and customer-focused professionals. 與亞太地區企業用戶合作，提供技術指導和系統培訓，協助超過 300 家組織構建項目解決方案，專業、高技能並以客戶為本，共同解決技術問題。
    • Created readiness UI and automatic flow utilizing Power Apps/Power Automate to improve customer satisfaction. 應用 Power Apps/Power Automate 建立團隊工作平台，提升客戶滿意度。

TSMC 台積電

emoji_events
  • Feb 2019 - Jul 2022

    System Integration Engineer 系統整合工程師

    • Developed web applications using ASP.NET Framework, ASP.NET Core, jQuery and Bootstrap for data analysis. 使用 ASP.NET Framework、ASP.NET Core、jQuery 以及 Bootstrap，開發網頁應用程式協助資料分析。
    • Developed ASP.NET Web API using Entity Framework Core. 開發 ASP.NET Web API 並使用 Entity Framework Core 串聯資料庫。
    • Developed WinForms applications using C#, VBA and SQL (Oracle, SQL Server) to enhance people productivity. 使用 C#, VBA 和 SQL (Oracle, SQL Server) 開發 WinForms 應用，提高人員生產力。
    • Constructed and managed the internal database of the department using MS SQL Server. 使用 MS SQL Server 建立並管理部門內部資料庫。
    • Collaborated with users and IT to define URD, driving continuous improvement of systems. 與使用者和 IT 跨部門合作，撰寫 URD 文件，持續精進系統。
    • Led a team of 5 technicians, managing customer requests for new product design to meet special demands. 帶領技術員團隊處理新產品設計，滿足客戶需求。
  • Nov 2014 - Feb 2019

    Process Integration Engineer 製程整合工程師

    • Developed InFO (Integrated Fan-Out) in conjunction with SoC (System-on-Chip) across N16/N10/N7/N5 technologies. 發展並研究用於可攜式電子產品的 3D IC 半導體先進封裝技術 InFO (Integrated Fan-Out)。
    • Defined the first process flow auto-creation SOP for TSMC 3DFabric and the bumping/assembly technology infrastructure for the 3D IC roadmap. 定義 TSMC 3DFabric 先進封裝自動化流程設計 SOP。
    • Collaborated with customers to resolve inline issues and improve yield. 與客戶合作設計實驗，解決製程問題，提升產品良率。
    • Managed process changes with perfect quality management and the interplay between technologies and processes. 管理高品質的製程流程精進。

Education 學歷

No one is born with it.

  • ...Ever after ...從此之後

    Self Learner 自學者

    mood

  • Master 碩士

  • Aug 2014

    Master's Degree 碩士學位

    MSc in Materials Science and Engineering, National Taiwan University. 國立台灣大學材料科學與工程學研究所

  • Jul 2013

    Exchange Program 交換學生

    Institute of Technology, Linköping University. (Linköping, SE) 瑞典林雪平大學科技學院

  • Jun 2013

    Thesis Defense 論文口試

    Thesis: Interfacial Reactions Between Copper Substrate and Lead-Free Solder for 3D IC Applications. 3D IC 封裝中銅基材與無鉛銲料接點之介面反應

  • Nov 2012

    Poster 海報發表

    Material Research Society-Taiwan (MRS-T). (Yunlin, TW) 中國材料科學學會年會

  • Mar 2012

    Session Presenter 口頭發表

    TMS 2012 Annual Meeting & Exhibition - Effects of Ultrafine Joints and Alloy/microstructure Relationships Session. (Orlando, FL)

  • Sep 2011

    Graduate Research Assistant 碩士研究助理

    Advanced Chip Packaging Laboratory (ACPL) 覆晶封裝實驗室 , Advisor: Prof. C. Robert Kao. （指導教授：高振宏特聘教授）

  • Bachelor 大學

  • Jun 2011

    Bachelor's Degree 學士學位

    BS in Materials Science and Engineering, National Taiwan University. 國立台灣大學材料科學與工程學系

  • Jul 2010

    Visiting Student 訪問學生

    Hertford College, University of Oxford. (Oxford, UK) 英國牛津大學哈特福學院

  • Sep 2007

    College Student 進入大學

    Department of Materials Science and Engineering, National Taiwan University. (Taipei, TW) 國立台灣大學材料科學與工程學系

  • May 1989

    Born in Taipei 出生於台北

    Hi there! 哈囉！